SuperSpeed USB 3.0 performance to double

Announced in Las Vegas yesterday the USB Implementers Forum (USB-IF) revealed details of a SuperSpeed USB 3.0 enhancement delivering ten times the speed of Hi-Speed USB (USB 2.0) and reaching a phenomenal 10Gbps data transfer rate.

In an effort to expand the usefulness of USB additional features have also been included in the SuperSpeed USB specifications with the SuperSpeed USB Inter-Chip (SSIC) and Mobile Broadband Interface Model (MBIM) specifications intended to increase the range of USB applications for mobile devices.

According to USB-IF, the key features of the new standard are:-

New 10 Gbps USB data rate.

Compatibility with existing cables and connectors.

Improved data encoding for more efficient data transfer leading to higher throughput and improved I/O power efficiency.

Compatible with existing USB 3.0 software stacks and device class protocols.

Compatible with both existing 5 Gbps and new 10 Gbps USB 3.0 hubs and devices, as well as USB 2.0 products.

As ever with technology standards these days, this development has been secured in stages with IEC endorsement of the standards culminating with industry wide commitment being announced in September 2012.

SuperSpeed USB certification is already progressing rapidly with more than 720 certified products already on the market.

The full USB-IF press release is available here and Intel's Bob Dunstan, who is the USB 3.0 Working Group Chairman discusses the advantages and technical details of USB 3.0 further here.