Toshiba today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest eMMC standard and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. According to Toshiba mass production will start from the end of November.
The company’s new 32 GB embedded device integrates four 8GB NAND chips fabricated with Toshiba's 19nm second generation process technology and a dedicated controller into a small package measuring 11.5 x 13 x 1.0mm. It is compliant with JEDEC eMMC Version 5.0, and Toshiba claims it achieves a high read/write performance by applying the HS400 high speed interface standard.
The 32 GB modules are able to write at 90 MB/s and the 16 GB modules are specified at a maximum write speed of 50 MB/s. Both are able to achieve read speeds of up to 270 MB/s.
Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.
