BREAKING: Intel and Micron announce 3D Xpoint - 1000x faster than NAND, non volatile

Intel and Micron today announced 3D Xpoint (3D Crosspoint) technology which they claim is up to 1000x faster than NAND and an individual die can store 128Gb of data  The technology is different from NAND but also non volatile. 3D Xpoint is also 1,000 times more durant than NAND memory and 10x more dense than conventional memory.

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The latency in 3D Xpoint is measured in nanoseconds compared to milliseconds and microseconds for HDDs and SSDs respectively.

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The 3D Xpoint technology is currently in production in Utah and partners will receive the first samples later this year.

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The companies haven't disclosed much information on the new memory type. All we know is that it will be a Cross Point Array Structure in which 128 billion memory cells can be accessed, each cell can store 1 bit of data. This means the initial capacity is 128Gb, which can be expaned by stacking memory layers. The cells, that don't work with transistors, are read and written by current differences.

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