Chip makers suffer from low QLC 3D NAND yield rates

Posted 03 October 2018 17:42 CET by Jan Willem Aldershoff

NAND memory chip manufacturers suffer from low yields in the production of QLC 3D NAND. They are struggling to improve yields to over 50% which could have a negative effect on the NAND market for the first half of next year.

While chip makers have issues with production of QLC 3D NAND, they improved and stabilized yield rates of TLC 3D NAND, according to sources of the Taiwanese website, Digitimes. Initially the chip manufacturers also suffered from unsatisfactionary yield rates, but later this year this improved.

The low yields of TLC 3D NAND memory earlier this year also caused, “substandard chips . . .  flooding the industry supply chain,” Digitimes writes.

“It may take a longer time for chip makers to improve their QLC NAND yields, the sources indicated. NAND flash prices for the first half of 2019 will be hit by continued oversupply, plus more substandard chips,”, according to sources of Digitimes.

All major NAND manufacturers, such as Samsung, SK Hynix, Toshiba/Western Digital and IM Flash (Intel/Micron joint venture), have announced production of QLC NAND.


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