Intel and Micron to end joint development of 3D Xpoint memory by 2019

Intel and Micron today announced they will stop working together on the production of 3D Xpoint memory after the second half of 2019. Until then, both companies will continue to work together on the development of the second generation of 3D Xpoint technology.

Intel and Micron to end joint development of 3D Xpoint memory by 2019

In practice this likely means that the IM Flash Technology (IMFT) joint venture will be disbanded from the second half of 2019, or some time later. It will not be the end of 3D Xpoint memory however, both companies will work independently on optimizing the technology, “for their respective product and business needs”, as the press release states.

Also the IMFT fab in the city of Lehi, Utah, will continue exist. According to the press release, both companies will continue to manufacture 3D Xpoint technology based memory in the Utah facility.

In that facility, Intel and Micron currently produce 3D Xpoint memory that Intel markets under the Optane brand. Sometime later, Micron is expected to introduce 3D Xpoint memory under the QuantX brand.

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Besides ending 3D Xpoint development, Intel and Micron announced earlier this year they will also no longer cooperate on 3D NAND memory.

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